Computer-Integrated Design and Manufacture of Integrated Circuits

Contains an introduction, principal objectives and accomplishments for this chapter's research, reports on two research projects and a list of publications.Defense Advanced Research Projects Agency Contract MDA 972 88-K-0008U.S. Navy Contract N00174-93-C-003

Computer-Integrated Design and Manufacture of Integrated Circuits

Contains an introduction, principal objectives and accomplishments, reports on two research projects and a list of publications.U.S. Navy Contract N00174-92-Q-013

Computer-Aided Fabrication System Structure

Contains report on one research project.Defense Advanced Research Projects Agency Contract MDA 972 88-K-000

Computer-Aided Fabrication System Structure

Contains reports on one research project.Defense Advanced Research Projects Agency MDA 972 88-K-000

Computer Microvision for Microelectromechanical Systems

Contains table of contents for Section 3 and reports on five research projects.Charles S. Draper Laboratory Contract DL-H-496015Defense Advanced Research Project Agency Grant F30602-97-2-0106W.M. Keck Foundation Career Development ProfessorshipAlfred P. Sloan Foundation Instrumentation Gran

Computer-Assisted Prototyping of Advanced Microsystems

Contains reports on five research projects.Defense Advanced Research Projects Agency Contract DABT 63-95-C-0088Stanford Universit

Computer-Integrated Design and Manufacture of Integrated Circuits

Contains reports on three research projects.Defense Advanced Research Projects Agency DABT 63-95-C-0088Defense Advanced Research Projects Agency N00174-93-K-0035Stanford UniversityLeaders for Manufacturing Progra

Computer-Integrated Design and Manufacture of Integrated Circuits

Contains research goals and objectives, reports on sixteen research projects and a list of publications.Defense Advanced Research Projects Agency/U.S. Navy Contract N00174-93-K-0035Defense Advanced Research Projects Agency/U.S. Army Contract DABT 63-95-C-0088Multisponsored Projects Industrial/MIT Leaders for Manufacturing Progra

Adjoint-based particle defect yield modeling for silicon photonics

© COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only. Integrated silicon photonics offers great potential for monolithic integrated photonic and electronic components using existing integrated circuit fabrication infrastructure. However, understanding of the impact of IC process variations on performance of photonic components remains limited. Methods for analysis that identify sensitivity of photonic components to the variety of process variations encountered during fabrication are crucial to enable viable design and manufacturing of silicon photonic systems. We present the application of the adjoint method to predict the impact of different types of particle defects on silicon photonic circuits. The adjoint method is applied for both component and circuit level analysis to reduce computational cost, and shows good consistency with direct simulations. The results for complicated device components and small circuits are shown and discussed. The model and results can be used to help generate layout design rules and critical area extraction methods, and to assist silicon photonics designers in predicting and optimizing yield of complex silicon photonics devices and circuits

A General Semiconductor Process Modeling Framework

A general semiconductor process modeling framework is presented. The framework encompasses first, a methodology for the description of any manufacturing process using state and state transformation information, and second, a conceptual process model that distinguishes between, and define terms for, the state information and state transformations involved in integrated circuit fabrication. This modeling methodology and conceptual semiconductor process model aid in the understanding of fabrication processes, provide a formalism for the description of processes, help to guide the development of process flow languages and representations, and support a number of process-related activities including process design and process control. 1 Introduction This paper presents a general framework for the modeling of semiconductor processing. On the most basic level, the intent of integrated circuit fabrication is to produce a wafer with specific electrical and mechanical characteristics, usually i..